NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys. This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.